US Patent 8004075 Semiconductor power module including epoxy resin coating
Patent 8004075 was granted and assigned to Hitachi on August, 2011 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
April 24, 2007
Date of Patent
August 23, 2011
Patent Application Number
11739122
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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