US Patent 8003896 Multi-layer printed wiring board and manufacturing method thereof
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Edits on 28 Nov, 2023
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Patent abstract
A multi-layer printed wiring board has a core substrate, a first interlayer insulation layer formed over the core substrate, a first filled via formed in the first interlayer insulation layer, a second interlayer insulation layer formed over the first interlayer insulation layer, and a second filled via formed in the second interlayer insulation layer. The first filled via has a bottom portion having a first diameter. The second filled via has a bottom portion having a second diameter smaller than the first diameter.
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Patent Inventor Names
Youhong Wu0
Edits on 22 May, 2023
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US Patent 08003896 Multi-layer printed wiring board and manufacturing method thereof US Patent 8003896 Multi-layer printed wiring board and manufacturing method thereof
Infobox
Patent Number
080038960
Patent Number
80038960
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
080038960
Date of Patent
August 23, 2011
0Patent Application Number
118326730
Date Filed
August 2, 2007
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 08003896 Multi-layer printed wiring board and manufacturing method thereof
Infobox
Is a
Patent jurisdiction
Patent number
08003896
Date of patent
August 23, 2011
Patent application number
11832673
Date Filed
August 2, 2007
Patent primary examiner
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