Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 23, 2011
Patent Application Number
12457324
Date Filed
June 8, 2009
Patent Primary Examiner
Patent abstract
An electronic parts packaging structure of the present invention includes a core substrate having such a structure that a recess portion is provided by forming a prepreg insulating layer having an opening portion therein on a resin layer, and an electronic parts mounted on a bottom portion of the recess portion of the core substrate such that a connection pad of the electronic parts is directed upward, and also, such a structure may be employed that the electronic parts is embedded in a resin layer of a core substrate having a structure that the resin layer is formed on the prepreg insulating layer.
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