Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kuo-Chung Yee0
Date of Patent
August 23, 2011
0Patent Application Number
124714550
Date Filed
May 25, 2009
0Patent Primary Examiner
Patent abstract
A package structure of optical devices has a chip, a sealant, a cover, a substrate, a plurality of bonding wires, and a transparent encapsulant. The chip has at least an optical device and a plurality of chip connection pads. The sealant is disposed around the optical elements. The cover is disposed on the sealant. The substrate supports the chip and has a plurality of connection pads. The bonding wires are used for electrically connecting the chip connection pads of the chip to the connection pads of the substrate. The transparent encapsulant is formed over the substrate and the cover, and encapsulates the bonding wires.
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