Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 9, 2011
Patent Application Number
10788207
Date Filed
February 27, 2004
Patent Citations Received
0
Patent Primary Examiner
Patent abstract
A system and method of structuring a supplemental interest mortgage is disclosed. A principal debt obligation and a supplemental debt obligation based on the principal debt loan are secured by a single security instrument. The principal debt obligation includes the principal loan and principal interest to compensate a lender for use of the lender's funds. The supplemental debt obligation includes supplemental interest to compensate a lender for the risk of borrower nonpayment.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.