US Patent 7989942 IC package with capacitors disposed on an interposal layer

Patent 7989942 was granted and assigned to Altera on August, 2011 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Altera

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7989942

Date of Patent

August 2, 2011

Patent Application Number

12356491

Date Filed

January 20, 2009

Patent Primary Examiner

‌

Quoc D Hoang

Patent abstract

An integrated circuit (IC) package with a plurality of chip capacitors placed on a surface of a die is disclosed. The chip capacitors may be placed on top of the die with an interposal substrate layer. Placing chip capacitors on top of the die may reduce the size of the packaging substrate required. One or more wires may be used to connect the chip capacitors on the interposal layer to the packaging substrate. The IC package may include a lid and a thermal interface material (TIM) placed on top of the die. The lid may be shaped such that a protruding portion of the lid contacts the die directly through the TIM to improve heat dissipation.