Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Joachim Mahler0
Steffen Jordan0
Mathias Vaupel0
Edmund Riedl0
Johannes Lodermeyer0
Date of Patent
August 2, 2011
Patent Application Number
11924134
Date Filed
October 25, 2007
Patent Primary Examiner
Patent abstract
A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.
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