Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 26, 2011
Patent Application Number
11735397
Date Filed
April 13, 2007
Patent Primary Examiner
Patent abstract
An integrated circuit package system is provided including providing a carrier, mounting an integrated circuit die on the carrier, connecting the integrated circuit die with the carrier, and forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress.
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