Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 19, 2011
Patent Application Number
11768939
Date Filed
June 27, 2007
Patent Primary Examiner
Patent abstract
A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
