Patent attributes
A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. The conductive pattern includes an underlying layer formed on the insulating layer and a conductive layer formed on the underlying layer. The underlying layer is formed with a corroded portion corroded from a side end portion of the conductive layer toward an inner portion thereof. A semiconductive layer is formed on a surface of the insulating layer and on a surface of the conductive pattern. The semiconductive layer is formed so as to come in contact with the metal supporting board and have a cut formed in the corroded portion to interrupt conduction between the semiconductive layer formed on the surface of the insulating layer and the semiconductive layer formed on a surface of the conductive layer.
