US Patent 7981789 Feature patterning methods and structures thereof

Patent 7981789 was granted and assigned to Infineon Technologies on July, 2011 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Infineon Technologies

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7981789

Date of Patent

July 19, 2011

Patent Application Number

12271606

Date Filed

November 14, 2008

Patent Primary Examiner

‌

Hoai V Pham

Patent abstract

Methods of patterning features, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a method of patterning a feature includes forming a first portion of the feature in a first material layer. A second portion of the feature is formed in the first material layer, and a third portion of the feature is formed in a second material layer.