US Patent 7981722 Semiconductor device and fabrication method thereof
Patent 7981722 was granted and assigned to Sony on July, 2011 by the United States Patent and Trademark Office.
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A semiconductor device and a fabrication method thereof are provided. A semiconductor device which is packaged as it includes a semiconductor in which an electronic circuit is disposed, the semiconductor device including: a substrate; a semiconductor chip which has a semiconductor main body having the electronic circuit formed thereon, a pad electrode formed on the semiconductor main body and a projected electrode that is connected to the pad electrode and projected from a surface of the semiconductor main body, wherein the semiconductor chip is mounted on the substrate from the back side of the surface to form the projected electrode thereon; and an insulating layer which is formed as the semiconductor chip buried therein and is polished from a top surface of the insulating layer to a height at which a top of the projected electrode is exposed.
US Patent 07981722 Semiconductor device and fabrication method thereof US Patent 7981722 Semiconductor device and fabrication method thereof
US Patent 07981722 Semiconductor device and fabrication method thereof
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