US Patent 7980863 Printed circuit board flexible interconnect design
Patent 7980863 was granted and assigned to Metrospec Technology, Llc on July, 2011 by the United States Patent and Trademark Office.
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Patent abstract
In some embodiments, a circuit board interconnect may include one or more of the following features: (a) a first circuit board having a plated through hole within a metal pad on the circuit board, the through hole providing a passage for solder to connect the first circuit board to a second circuit board, (b) a second circuit board having a metal pad able to couple to the first circuit board in an overlapping fashion when solder is passed through the plated through hole, and (c) a non-conductive solder repelling material on a surface of one circuit board.
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US Patent 07980863 Printed circuit board flexible interconnect design US Patent 7980863 Printed circuit board flexible interconnect design
Infobox
Patent Number
0798086300
Patent Number
798086300
Edits on 27 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079808630
Date of Patent
July 19, 2011
0Patent Application Number
123724990
Date Filed
February 17, 2009
0Patent Primary Examiner
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079808630
Date of Patent
July 19, 2011
0Patent Application Number
123724990
Date Filed
February 17, 2009
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
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US Patent 07980863 Printed circuit board flexible interconnect design
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07980863
Date of patent
July 19, 2011
Patent application number
12372499
Date Filed
February 17, 2009
Patent primary examiner
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