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US Patent 7978478 Printed circuit board

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
February 19, 2008
Date of Patent
July 12, 2011
Patent Application Number
12033302
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
0
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US Patent 11931855 Planarization methods for packaging substrates
0
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US Patent 11705365 Methods of micro-via formation for advanced packaging
0
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US Patent 11715700 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
0
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US Patent 11862546 Package core assembly and fabrication methods
0
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7978478
Patent Primary Examiner
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Tuan T Dinh

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