US Patent 7977778 Integrated circuit package system with interference-fit feature
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Edits on 28 Nov, 2023
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Patent abstract
An integrated circuit package system is provided including forming an integrated circuit die, forming an interference-fit feature in the integrated circuit die, fitting a support element within the interference-fit feature, connecting an external interconnect and the integrated circuit die, and encapsulating the integrated circuit die.
Edits on 19 Sep, 2023
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Patent Inventor Names
Henry Descalzo Bathan0
Lionel Chien Hui Tay0
Zigmund Ramirez Camacho0
Edits on 21 May, 2023
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US Patent 07977778 Integrated circuit package system with interference-fit feature US Patent 7977778 Integrated circuit package system with interference-fit feature
Infobox
Patent Number
079777780
Patent Number
79777780
Edits on 3 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079777780
Date of Patent
July 12, 2011
0Patent Application Number
117446970
Date Filed
May 4, 2007
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07977778 Integrated circuit package system with interference-fit feature
Infobox
Is a
Patent jurisdiction
Patent number
07977778
Date of patent
July 12, 2011
Patent application number
11744697
Date Filed
May 4, 2007
Patent primary examiner
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