US Patent 7974104 Printed wiring board and connection configuration of the same

Patent 7974104 was granted and assigned to Fujikura on July, 2011 by the United States Patent and Trademark Office.

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Edits on 28 Nov, 2023

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Golden AI

edited on 28 Nov, 2023

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Patent abstract

A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.

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Patent Inventor Names

Hiroki Maruo0

Tomofumi Kitada0

Edits on 23 May, 2023

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