A contact for a burn-in socket electrically connecting an IC package and a printed circuit board, comprises a first contact, a second contact and a spring disposed between the first contact and the second contact. The first contact and the second contacts have a same configuration, and each contact has a U-shaped actuating portion with two legs and a conductive portion extending from one of the legs. The first contact and the second contact are orthogonally assembled together, and the first actuating portion bestrides the second actuating portion to clasp with second actuating portion, so that the conductive portions have an offset therebetween.