US Patent 7968420 Manufacturing semiconductor device and method of manufacturing electronic apparatus

A method for manufacturing a semiconductor device, includes: forming an insulating film on a substrate; selectively removing the insulating film, so as to form a groove including a first groove area having a first depth and a second groove area having a second depth, the second depth being smaller than the first depth; infusing a conductive liquid material into the first groove area and the second groove area; treating the conductive liquid material, so as to form a first conductive film in the first groove area and a second conductive film in the second groove area; and forming a second insulating film on the first and the second conductive films, followed by forming a third conductive film on the second insulating film.