Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sri M. Sri-Jayantha0
Date of Patent
June 21, 2011
0Patent Application Number
116754450
Date Filed
February 15, 2007
0Patent Primary Examiner
Patent abstract
A method (and apparatus) of assembling a die on an electronic substrate, includes processing an assembly including a substrate and a die, and during the processing, introducing a pre-stress to the assembly during a cure process.
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