Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 7, 2011
Patent Application Number
12023921
Date Filed
January 31, 2008
Patent Primary Examiner
Patent abstract
Power wafer level chip scale package (CSP) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of the device, which is convenient for mounting to a printed circuit board (PCB) with solder paste.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
