Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Alexander Leon0
Date of Patent
June 7, 2011
Patent Application Number
12263469
Date Filed
November 1, 2008
Patent Primary Examiner
Patent abstract
A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.
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