US Patent 7952182 Semiconductor device with package to package connection

Patent 7952182 was granted and assigned to Intel on May, 2011 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7952182

Date of Patent

May 31, 2011

Patent Application Number

12165315

Date Filed

June 30, 2008

Patent Citations Received

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US Patent 11670520 Package structure with interconnection between chips and packaging method thereof

Patent Primary Examiner

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Thao P. Le

Patent abstract

A semiconductor package comprises a first package; a second package that is provided on the first package; and a first interconnect that comprises a bump to couple to the first package and a base material layer to cover the bump, wherein the second package is supported on the base material layer that is coupled to the bump.