Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 31, 2011
Patent Application Number
11630565
Date Filed
June 3, 2005
Patent Primary Examiner
Patent abstract
A method produces of a ceramic circuit board that has a ceramic substrate on a top side of the circuit board, solderable contact pads for components, and solderable contacts on an underside of the circuit board. The metallization for the solderable contact pads is produced by depositing a metal from a solution directly onto the ceramic substrate.
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