Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 17, 2011
Patent Application Number
12051687
Date Filed
March 19, 2008
Patent Primary Examiner
Patent abstract
The present invention relates to a method of cutting PCB module using a laser. The method includes steps of: providing a coverlay film, the coverlay film including at least one opening defined therein; attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening; applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and removing the coverlay film. A high positioning precision of the PCB module and better cutting result can be obtained.
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