US Patent 7939920 Multiple die integrated circuit package
Patent 7939920 was granted and assigned to SanDisk on May, 2011 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
September 3, 2008
0
Date of Patent
May 10, 2011
0
Patent Application Number
12203496
0
Patent Inventor Names
Robert F. Wallace
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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