Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Alan O'Donnell0
Thomas M. Goida0
Oliver Kierse0
Date of Patent
May 10, 2011
0Patent Application Number
116270410
Date Filed
January 25, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An electronics package includes a wafer die substrate containing electronic circuits and having a top surface and a bottom surface. A top protective layer is substantially thinner than the substrate and covers the top surface. A bottom protective layer is substantially thinner than the substrate and covers the bottom surface. Circuit contacts are distributed about the bottom protective layer for electrically coupling the substrate electronic circuits to external electronic circuits.
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