US Patent 7937832 Method of producing a wired circuit board
Patent 7937832 was granted and assigned to Nitto Denko on May, 2011 by the United States Patent and Trademark Office.
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A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.
US Patent 07937832 Method of producing a wired circuit board US Patent 7937832 Method of producing a wired circuit board
US Patent 07937832 Method of producing a wired circuit board
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