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US Patent 7919140 Process for producing pressure-sensitive adhesive layer

Patent 7919140 was granted and assigned to Nitto Denko on April, 2011 by the United States Patent and Trademark Office.

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Patent
Patent

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Current Assignee
Nitto Denko
Nitto Denko
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7919140
Patent Inventor Names
Kunio Nagasaki0
Isao Hirose0
Kazuhisa Maeda0
Date of Patent
April 5, 2011
Patent Application Number
12162736
Date Filed
January 31, 2008
Patent Primary Examiner
‌
Sanza L. McClendon
Patent abstract

The present invention relates to a process for producing a pressure-sensitive adhesive layer, which includes irradiating a photopolymerizable acrylic pressure-sensitive adhesive composition layer provided between two films with an active energy beam to polymerize the photopolymerizable acrylic pressure-sensitive adhesive composition layer, in which the polymerization is performed while a layer of a composition for preventing polymerization inhibition which is curable with an active energy beam in the atmosphere is provided on a side surface of the photopolymerizable acrylic pressure-sensitive adhesive composition layer. According to the process for producing a pressure-sensitive adhesive layer of the present invention, owing to the construction as discussed above, it is possible to reuse a film. Moreover, it is possible to prevent a lowering in the cohesive force in the side surface of the thus formed pressure-sensitive adhesive composition layer caused by a lowering in the polymerization degree in the side surface of the photopolymerizable acrylic pressure-sensitive adhesive composition layer during the photopolymerization.

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