Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hiroshi Kudo0
Date of Patent
March 29, 2011
Patent Application Number
12268712
Date Filed
November 11, 2008
Patent Primary Examiner
Patent abstract
A semiconductor device which includes a first wiring with a via connected to the first wiring, a second wiring connected to the via and a dummy via disposed adjacent to the via at a distance of 100 nm or less and formed on the same layer as the via.
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