Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Saburo Miyamoto0
Masayuki Yamamoto0
Date of Patent
March 29, 2011
0Patent Application Number
123906610
Date Filed
February 23, 2009
0Patent Primary Examiner
Patent abstract
An adhesive tape joining apparatus of this invention adopts an inverted “T”-shaped layout configured with a rectangular section that extends laterally when being viewed in a plane and a protrusion section that is coupled on a center of the rectangular section. An adhesive tape joining part is disposed in the protrusion section and joins an adhesive tape to a ring frame and a wafer. A transport mechanism is disposed in the rectangular section and transports the wafer, the ring frame, and the wafer held by the ring frame. An electronic substrate processing unit is disposed in at least one of two regions adjoining to the rectangular section with the protrusion section being interposed therebetween, and is coupled to the transport mechanism.
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