US Patent 7911045 Semiconductor element and semiconductor device

A semiconductor element is provided with electrode pads which are arranged on a front surface of an element main body, an insulating protection film which covers the front surface of the element main body excepting its outer peripheral area while exposing the electrode pads, and an insulating adhesive layer which is formed to cover a back surface, a sidewall surface and a corner between the front surface and the sidewall surface of the element main body. A plurality of semiconductor elements are stacked on a circuit substrate. The semiconductor elements are adhered via the insulating adhesive layer.