Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Katsutoshi Kamei0
Date of Patent
March 1, 2011
0Patent Application Number
122195990
Date Filed
July 24, 2008
0Patent Primary Examiner
Patent abstract
A method of producing a wired circuit board includes preparing a metal supporting board, forming a metal foil on the metal supporting board, forming an insulating layer on the metal foil to expose an unneeded portion of the metal foil, etching the unneeded portion using the insulating layer as an etching resist, and forming a plurality of wires on the insulating layer.
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