Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 22, 2011
Patent Application Number
12713065
Date Filed
February 25, 2010
Patent Primary Examiner
Patent abstract
A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, the packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.
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