Log in
Enquire now
‌

US Patent 7892290 Fluted sleeve hip prosthesis for modular stem

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7892290
Date of Patent
February 22, 2011
Patent Application Number
11625151
Date Filed
January 19, 2007
Patent Citations Received
‌
US Patent 12121441 Bone void forming apparatus
0
‌
US Patent 11857205 Void filling joint prosthesis and associated instruments
0
‌
US Patent 11877757 Systems and methods for preparing bone voids to receive a prosthesis
0
‌
US Patent 12121243 Void filling joint prosthesis and associated instruments
0
‌
US Patent 11684398 Press fit stem
0
Patent Primary Examiner
‌
David H Willse
Patent abstract

An intramedullary implant for mounting within an intramedullary canal of a bone is disclosed. The intramedullary implant includes a lower stem portion, an upper stem portion, and a modular sleeve body. The modular sleeve body is connected to one of the lower stem portion or the upper stem portion. The sleeve body includes an inner portion that covers at least a segment of the upper stem portion and has one or more longitudinally extending bone engagement members for engagement with the bone.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 7892290 Fluted sleeve hip prosthesis for modular stem

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.