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US Patent 7888639 Method and apparatus for processing a micro sample

Patent 7888639 was granted and assigned to Hitachi on February, 2011 by the United States Patent and Trademark Office.

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Patent
Patent

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Current Assignee
Hitachi
Hitachi
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7888639
Date of Patent
February 15, 2011
Patent Application Number
11980654
Date Filed
October 31, 2007
Patent Primary Examiner
‌
Bernard E Souw
Patent abstract

An object of the invention is to realize a method and an apparatus for processing and observing a minute sample which can observe a section of a wafer in horizontal to vertical directions with high resolution, high accuracy and high throughput without splitting any wafer which is a sample. In an apparatus of the invention, there are included a focused ion beam optical system and an electron optical system in one vacuum container, and a minute sample containing a desired area of the sample is separated by forming processing with a charged particle beam, and there are included a manipulator for extracting the separated minute sample, and a manipulator controller for driving the manipulator independently of a wafer sample stage.

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