Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sean M Malolepszy0
Rex W Pirkle0
Date of Patent
February 8, 2011
Patent Application Number
12630364
Date Filed
December 3, 2009
Patent Primary Examiner
Patent abstract
The present invention provides a process for manufacturing an integrated circuit (IC) package and an integrated circuit (IC) package. The process, without limitation, includes providing an integrated circuit chip having a configuration, and forming a layer of overcoat material over the integrated circuit chip based upon the configuration.
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