US Patent 7881457 Apparatus and method of single-in-line embedded modem

Patent 7881457 was granted and assigned to Wintec Industries on February, 2011 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Wintec Industries

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

78814570

Patent Inventor Names

KongChen Chen0

Simon S. C. Chen0

Date of Patent

February 1, 2011

Patent Application Number

103752260

Date Filed

February 26, 2003

Patent Primary Examiner

‌

Walter F Briney, III

Patent abstract

The invention is a compact embedded modem that meets global telephone standards with its interface constructed in a single-in-line form factor. The modem in single-in-line form factor, namely SIP modem, can be integrated into a host system through a single-in-line header socket. The SIP interface includes TIP and RING signals for connecting to a phone line, isolation spacers, ground pin, power pin, and digital signals for transferring data to and from the host. The digital interface can be configured to operate in serial connection or in parallel connection to the host, selectable by user.