US Patent 7880287 Stud bumps for die alignment

Embodiments include but are not limited to apparatuses and systems including a package having stud bumps for die alignment. A package may include a package substrate, and a plurality of stud bumps coupled to the package substrate. The stud bumps may define a die region of the package substrate in which movement of a die disposed within the die region is restricted prior to attachment of the die to the package substrate, wherein the plurality of stud bumps comprise a profile that is less than a profile of the die when attached to the package substrate. Other embodiments may be described.