Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
James G. Neff0
Michael R. Krames0
John E. Epler0
Date of Patent
January 25, 2011
0Patent Application Number
123973920
Date Filed
March 4, 2009
0Patent Primary Examiner
Patent abstract
A compliant bonding structure is disposed between a semiconductor light emitting device and a mount. When the semiconductor light emitting device is attached to the mount, for example by providing pressure, heat, and/or ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.
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