US Patent 7875811 High speed interposer

Patent 7875811 was granted and assigned to Endicott Interconnect Technologies, Inc. on January, 2011 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

‌

Endicott Interconnect Technologies, Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

78758110

Patent Inventor Names

Frank D. Egitto0

David V. Caletka0

Date of Patent

January 25, 2011

Patent Application Number

120103350

Date Filed

January 24, 2008

Patent Primary Examiner

‌

Ishwarbhai B. Patel

Patent abstract

A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in some embodiments), and a plurality of shielding members positioned substantially around the conductive members to provide shielding therefore during the passage of high frequency signals through the conductive members.