Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 18, 2011
Patent Application Number
12042025
Date Filed
March 4, 2008
Patent Primary Examiner
Patent abstract
A semiconductor device is disclosed that includes a wiring board having a via formed therein; a semiconductor element provided on the wiring board; a resist layer covering a surface of the wiring board, the resist layer having an opening in a part thereof positioned on the via; and a sealing resin covering the surface of the via in the opening and the resist layer, and sealing the semiconductor device.
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