Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Michael G. Kelly0
Date of Patent
January 11, 2011
0Patent Application Number
108204840
Date Filed
April 8, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Integrated circuit systems with thermal dissipation enhancement features are described. In one aspect, an integrated circuit system includes a die incorporating an integrated circuit. The die has a top side and a bottom side. The top side supports an electrical signal communication metallization and a top side thermal dissipation metallization. The bottom side supports a bottom side thermal dissipation metallization.
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