Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 11, 2011
Patent Application Number
12730171
Date Filed
March 23, 2010
Patent Primary Examiner
Patent abstract
An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
