Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seng Guan Chow0
Lionel Chien Hui Tay0
Date of Patent
January 4, 2011
0Patent Application Number
120504000
Date Filed
March 18, 2008
0Patent Primary Examiner
Patent abstract
A ball grid array package system comprising: forming a package base including: fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader, mounting a substrate around the integrated circuit die, and coupling an electrical interconnect between the integrated circuit die and the substrate; and coupling a second integrated circuit package to the substrate through the access port.
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