US Patent 7863699 Bonded wafer package module
Patent 7863699 was granted and assigned to TriQuint Semiconductor on January, 2011 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 21, 2008
0
Date of Patent
January 4, 2011
0
Patent Application Number
12124925
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Patent Inventor Names
Uppili Sridhar
0
Carlton Stuebing
0
Hans Dropmann
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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