Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 4, 2011
Patent Application Number
11807686
Date Filed
May 29, 2007
Patent Primary Examiner
Patent abstract
A method and/or system are provided for producing a structure comprising a thin layer of semiconductor material on a substrate. The method includes creating an area of embrittlement in the thickness of a donor substrate, bonding the donor substrate with a support substrate and detaching the donor substrate at the level of the area of embrittlement to transfer a thin layer of the donor substrate onto the support substrate. The method also includes thermal treatment of this resulting structure to stabilize the bonding interface between the thin layer and the substrate support. The invention also relates to the structures obtained by such a process.
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