Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 28, 2010
Patent Application Number
11540543
Date Filed
October 2, 2006
Patent Primary Examiner
Patent abstract
A pad area and a method of fabricating the same, wherein the pad area is formed on a substrate to contact a chip on glass (COG) or a chip on flexible printed circuit (COF) with the substrate. Changing a lower structure of the pad area increases contact points between conductive balls and an interconnection layer or reduces a step difference between an interconnection layer and a passivation layer to enhance and ensure electrical connection.
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