Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bo-I Lee0
Dean Wang0
Date of Patent
December 14, 2010
0Patent Application Number
121767700
Date Filed
July 21, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method provides a first substrate with a conductive pad and disposes layers of Cu, TaN, and AlCu, respectively, forming a conductive stack on the conductive pad. The AlCu layer of the first substrate is bonded to a through substrate via (TSV) structure of a second substrate, wherein a conductive path is formed from the conductive pad of the first substrate to the TSV structure of the second substrate.
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