US Patent 7846780 Flip-chip package covered with tape
Patent 7846780 was granted and assigned to Spansion on December, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.
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Patent Inventor Names
Naomi Masuda0
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Official Website
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US Patent 07846780 Flip-chip package covered with tape US Patent 7846780 Flip-chip package covered with tape
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Patent Number
07846780
Patent Number
7846780
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US Patent 07846780 Flip-chip package covered with tape
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Is a
Current assignee
Patent jurisdiction
Patent number
07846780
Date of patent
December 7, 2010
Patent application number
12012388
Date Filed
February 1, 2008
Patent primary examiner
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