US Patent 7843694 Heat-dissipating module and electronic device having the same

Patent 7843694 was granted and assigned to Wistron Corporation on November, 2010 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Wistron Corporation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7843694

Date of Patent

November 30, 2010

Patent Application Number

12417343

Date Filed

April 2, 2009

Patent Primary Examiner

Boris L. Chervinsky

Patent abstract

An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop.